MEMS Process Engineer
October 2015 — Present
Iterative design and development of ~2um microfabrication processes and developing "traveler" SOPs for production.
Two and three-factor DOE with focus on statistical significance and production compatibility.
Extensive experience with creating, updating/maintaining and collaborating on engineering technical documents.
Networking skills and communication involve working with vendors and industry contacts to determine state of the art solutions for open challenges.
Thin wafer handling: I developed a method for reliably handling 45um thick (100mm diameter) wafers through photolithography, dry etching and wet etching.
Designed and implemented a process for a high temperature polymer bond using existing tooling in a flexible process that increases die yield by >10% while adding <5% cost.
High yield: Consistently high yield, attributable to paying careful attention to critical details and planning/documenting carefully.