University of Malaya
PhD Researcher (Material reliability and lifetime)
March 2013 — Present
Research on material reliability at the joint strength that examine the influence of minor addition of element in common composition of solder alloy. The focus is on the low cost effect in the electronics assembly and packaging.
1) Corrosion potential in electronics assembly environement
2) Mechanical reliability at the joint strength
3) Simulation of BGA assembly under mechanical loading
4) Material charaterization for failure modes and impact of corrosion on material surface